CEEISP 2023

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J. K. Z., University of Ottawa, Canada

H. X., Hangzhou Normal University, China

X. C. M., Hangzhou Normal University, China

A. B., Amrita University, India
S. P. F., Universiti Sains Malaysia, Malaysia
Y. Z., Southeast University, China
Z. K. L., Rensselaer Polytechnic Inst., USA
B. C. H., Tsinghua University, China
A. J., Saradar Vallabhbhai National Institute of Technology, India
P. L. D., Henan University of Technology, China
G. F. J., Yeungnam University, Korea
D. C. D., University of Regina, Canada
V. Ch. M., University of Macau, Macau
H. W. S., Yangzhou University, China
K. C. H., University of Jaen, Spain
M. C. Y., Zunyi Normal University, China
A. R., Air University, Islamabad Pakistan
S. C., Heidelberg University, Germany